Lithography

• <1um resolution
• EVG 620 Precision Alignment System & Bond Aligner for 4" and 6"
• Karl Suss MA 56 Aligner

Mask Plate Making

• 1um resolution
• HIMT DWL200 Laser Direct Writing
• Mask Plate Request Form

Wafer Bonding

• EVG 501 Universal Bonder 4" and 6"
• Silicon to glass anodic bonding
• Eutectic bonding
• Thermocompression bonding
• Fusion Bonding

Deep Reactive Ion Etching (DRIE)

• STS Multiplex ASE HRM System for 4" and 6" wafers, upgradeable to 8"

Plasma Enhanced Chemical Vapor Deposion (PECVD)

• STS Multiplex CVD System for 4" and 6" wafers, upgradeable to 8"
• Silicon Dioxide
• Stress free silicon nitride
• Amorphous silicon
• PhosphoSilicate Glass (PSG)
• BoroPhosphoSilicate Glass (BPSG)
• Reactive Ion Etching (RIE) capability

Reactive Ion Etching (RIE)

• STS Multiplex RIE System for 4" and 6" wafers, upgradeable to 8"
• Silicon Dioxide
• Silicon nitride
• Aluminum
• BCB
• Polyimide
• Non-plasma silicon etching based on Xenon Difluoride (XeF2) gas

Dry / Wet Oxidation

• RCA cleaning prior to high-temperature treatment
• Atmospheric thermal dry oxidation
• Atmospheric thermal wet oxidation
• High temperature drive-in under inert atmosphere
• 5 furnaces, THERMCO

Diffusion

• Boron diffusion using BBr3 and B2H6 gases
• Phosphorus diffusion using POCl3 gas
• 26 furnaces, THERMCO

Etching

• Silicon dioxide etching with BHF solution
• Silicon nitride etching
• Anisotropic silicon etching using KOH, TMAH, and EDP
• Isotropic silicon etching using HNA
• Electrochemical etching using KOH and TMAH solutions
• Metal etching: Al, Cu, Ti, Ni, Cr, Au
• Resist stripping in organic solvents

Plasma Etching

• Resist strip
• Descum

Electroplating (FIBRoplate process, uniformly on 4" & 6" wafers)

• Nickel electroplating
• Copper electropating
• Gold electroplating

SU-8 molding (Under development)

Evaporation and Sputterring (Al, Au, Au/As, Ni, Cr, Ni-Cr, Cu, Ti)

• VARIAN 3119 e-gun source system & BALZERS BAS 450 PM planar magnetron sputtering system
• BALZERS BAS 450 PM planar magnetron sputtering system

Passivation

• PSG (G.S. TEMPRESS B.V.)

Metrology

• Veeco Dektak 8 Profiler
• Veeco Wyko NT 1100 Profiler
• FTIR-210 IR-VASE Elipsometer
• Nanospec/AFT Computerized Film Thickness Measurement System
• Magnetron Model M-700 Four Point Probe System
• JEOL Scanning Electron Microscope (SEM)
• Karll Suss PM5 Manual Probe Station with Laser Cutter
• Airborn particle scanner
• Optical inspection x100

Wafer Dicing

• DISCO DAD 3350
• DISCO DAD 321
• Silicon, glass, silicon-to-glass bonded and GaAs substrates
• Dicing Request Form

Wire-Bonding

• Kluicke & Soffa Manual Gold Wire-Bonder

Back-lapping (SPEEDFAM)

Detailed Processing Equipment List

EXAR Bipolar Technology Know-How Package